MultiVu raises $7M seed round for its next-gen 3D sensor

By Frederic Lardinois

MultiVu, a Tel Aviv-based startup that is developing a new 3D imaging solution that only relies on a single sensor and some deep learning smarts, today announced that it has raised a $7 million seed round. The round was led by crowdfunding platform OurCrowd, Cardumen Captial and Hong Kong’s Junson Capital.

Tel Aviv University’s TAU Technology Innovation Momentum Fund supported some of the earlier development of MultiVu’s core technology, which came out of Prof. David Mendlovic’s lab at the university. Mendlovic previously co-founded smartphone camera startup Corephotonics, which was recently acquired by Samsung.

The promise of MultiVu’s sensor is that it can offer 3D imaging with a single-lens camera instead of the usual two-sensor setup. This single sensor can extract depth and color data in a single shot.

This makes for a more compact setup and, by extension, a more affordable solution since it requires fewer components. All of this is powered by the company’s patented light field technology.

Currently, the team is focusing on using the sensor for face authentication in phones and other small devices. That’s obviously a growing market, but there are also plenty of other application for small 3D sensors, ranging from other security use …read more

Source:: Tech Crunch Funding and Exits

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